3inch copper bond pads
Update：2019/5/17 10:09:51 View：1453
- Type： FS-Copper01
- Description：
Grit:30#, 50#, 80#, 100#, 200#
Height:5mm
Usage:Dry
Introduction
Copper bond diamond polishing pad is designed to transition from a metal bond diamond grinding process to a resin polishing process, it not only can remove the scratches left after metal bond diamond grinding process, but also can reduce the consumption of resin bond diamond polishing pads.
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